Method and apparatus for making a MEMS scanner

Devices are formed on a semiconductor wafer in an interdigitated relationship and are released by deep reactive ion etching. MEMS scanners are formed without a surrounding frame. Mounting pads extend outward from torsion arms. Neighboring MEMS scanners are formed with their mounting pads interdigita...

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Bibliographische Detailangaben
Hauptverfasser:	HELSEL MARK P, LINDEN KELLY D, SPRAGUE RANDALL B, BROWN DEAN R, DAVIS WYATT O
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PERFORMING OPERATIONS PHYSICS PICTORIAL COMMUNICATION, e.g. TELEVISION PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	Devices are formed on a semiconductor wafer in an interdigitated relationship and are released by deep reactive ion etching. MEMS scanners are formed without a surrounding frame. Mounting pads extend outward from torsion arms. Neighboring MEMS scanners are formed with their mounting pads interdigitated such that a regular polygon cannot be formed around a device without also intersecting a portion of one or more neighboring devices. MEMS scanners may be held in their outlines by a metal layer, by small semiconductor bridges, or a combination.