Thermal interface and method of making the same

Thermal interface and method of making the same

A thermal interface material and methods for preparing the same are disclosed. The thermal interface material comprises a copper mesh and a slurry. The copper mesh is impregnated and coated with the slurry. The slurry comprises a liquid metal alloy mixed with a plurality of thermal conductive partic...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LARSON RALPH I, PROULX ROBERT J
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A thermal interface material and methods for preparing the same are disclosed. The thermal interface material comprises a copper mesh and a slurry. The copper mesh is impregnated and coated with the slurry. The slurry comprises a liquid metal alloy mixed with a plurality of thermal conductive particles. The methods include methods for preparing the thermal interface material, preparing the slurry, preparing the mesh, preparing the device for receiving the material, and for applying the thermal interface to the device.