System and method for providing cooling in a three-dimensional infrastructure for massively scalable computers

System and method for providing cooling in a three-dimensional infrastructure for massively scalable computers

A three-dimensional computer infrastructure cooling system is provided. The three-dimensional computer infrastructure cooling system includes at least one compute, storage, or communications brick. In addition, the three-dimensional computer infrastructure cooling system includes at least one coldra...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: FLEINER CLAUDIO M, RIES MANFRED, WILCKE WINFRIED W, FERNANDEZ KENNETH R, HUELS HARALD, GARNER ROBERT B
Format: Patent
Sprache:eng
Schlagworte:
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
PHYSICS
TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
TECHNICAL SUBJECTS COVERED BY FORMER USPC
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A three-dimensional computer infrastructure cooling system is provided. The three-dimensional computer infrastructure cooling system includes at least one compute, storage, or communications brick. In addition, the three-dimensional computer infrastructure cooling system includes at least one coldrail to facilitate the removal of heat from the at least one compute, storage, or communications brick. Also, the three-dimensional computer infrastructure includes a brick-internal carrier within the at least one compute, storage, communications brick, wherein the brick-internal carrier is attached to the at least one coldrail. Moreover, the three-dimensional computer infrastructure includes a power dissipating electronic element within the at-least-one compute, storage, or communications brick, wherein the power dissipating element is attached to the brick-internal carrier.