THREE-LEVEL LEADFRAME FOR NO-LEAD PACKAGES

THREE-LEVEL LEADFRAME FOR NO-LEAD PACKAGES

A semiconductor device ( 700 ) having a leadframe with a first plurality of segments ( 110 ) having a narrow end portion ( 111 ) in a first horizontal plane ( 211 ) and a wide end portion ( 112 ) in a second horizontal plane ( 212 ). The leadframe further includes a second plurality of segments ( 12...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: YAMUNAN VINU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor device ( 700 ) having a leadframe with a first plurality of segments ( 110 ) having a narrow end portion ( 111 ) in a first horizontal plane ( 211 ) and a wide end portion ( 112 ) in a second horizontal plane ( 212 ). The leadframe further includes a second plurality of segments ( 120 ) having a narrow center portion ( 121 ) in the first horizontal plane, at least one wide center portion ( 122 ) in the second horizontal plane, and narrow end portions ( 123 ) in a third horizontal plane ( 213 ), which is located between the first and second planes.