Repatterned integrated circuit chip package

A repatterned integrated circuit chip package which balances and/or reduces the package capacitance associated with the gain resistor terminals to reduce the degradation of common mode rejection with frequency.

Bibliographische Detailangaben

Hauptverfasser:	TRAN CHAU C, GERSTENHABER MOSHE
Format:	Patent
Sprache:	eng
Schlagworte:	AMPLIFIERS BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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