THICK FILM CONDUCTOR COMPOSITIONS FOR USE IN MEMBRANE SWITCH APPLICATIONS

The present invention relates to a thick film conductor composition comprising: (a) electrically conductive silver powder; (b) PVDF/HFP polymer resin, copolymers of a PVDF/HFP polymer resin, and mixtures thereof; dissolved in (c) organic solvent, with the provisos that the PVDF/HFP resin has a melt...

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Bibliographische Detailangaben
1. Verfasser:	DORFMAN JAY R
Format:	Patent
Sprache:	eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRIC SWITCHES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY EMERGENCY PROTECTIVE DEVICES INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL RELAYS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SELECTORS SPRAYING OR ATOMISING IN GENERAL THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The present invention relates to a thick film conductor composition comprising: (a) electrically conductive silver powder; (b) PVDF/HFP polymer resin, copolymers of a PVDF/HFP polymer resin, and mixtures thereof; dissolved in (c) organic solvent, with the provisos that the PVDF/HFP resin has a melt viscosity of 0.2-0.7 kPoise and a DSC melt temperature in the range of 85-98° C.