Sheet having microsized architecture

A sheet ( 20 ) for use in microfluidic, microelectronic, micromechanical, and/or microoptical applications requiring through-flow, through-conductivity, through-transmission, and/or other through patterns. The sheet ( 20 ) includes micro-sized architecture including at least one via ( 22 ) extending...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	PRICONE ROBERT M, THEILMAN W. S, CORCORAN CRAIG S, JAECKLEIN WILLIAM J, CHIU CINDY C, CHEN DAVID H
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CUTTING CUTTING-OUT HAND CUTTING TOOLS PERFORATING PERFORMING OPERATIONS PUNCHING SEVERING SEVERING BY MEANS OTHER THAN CUTTING SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS STAMPING-OUT TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A sheet ( 20 ) for use in microfluidic, microelectronic, micromechanical, and/or microoptical applications requiring through-flow, through-conductivity, through-transmission, and/or other through patterns. The sheet ( 20 ) includes micro-sized architecture including at least one via ( 22 ) extending through the thickness of the layer of thermoplastic material. The via-defining walls in the thermoplastic layer are formed by the thermoplastic material flowing around a projection and then solidifying around the projection.