Plastic dual-in-line packaging (PDIP) having enhanced heat dissipation

Plastic dual-in-line packaging (PDIP) having enhanced heat dissipation

According to one embodiment, an electronic device comprising a plastic dual-in-line packaging (PDIP) package structure is provided. The PDIP package structure includes a mold structure, a die disposed within the mold structure, and a die attach pad coupled to the die. The die attach pad has a first...

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Bibliographische Detailangaben
1. Verfasser: COYLE ANTHONY L
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:According to one embodiment, an electronic device comprising a plastic dual-in-line packaging (PDIP) package structure is provided. The PDIP package structure includes a mold structure, a die disposed within the mold structure, and a die attach pad coupled to the die. The die attach pad has a first surface exposed from the mold structure.