Electrocoating process to form a dielectric layer in an organic substrate to reduce loop inductance

The present invention includes forming a thin, conformal, high-integrity dielectric coating between conductive layers in a via-in-via structure in an organic substrate using an electrocoating process to reduce loop inductance between the conductive layers. The dielectric coating is formed using a hi...

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Bibliographische Detailangaben

Hauptverfasser:	WERMER PAUL H, KAISER BRIAN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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