Electrocoating process to form a dielectric layer in an organic substrate to reduce loop inductance

The present invention includes forming a thin, conformal, high-integrity dielectric coating between conductive layers in a via-in-via structure in an organic substrate using an electrocoating process to reduce loop inductance between the conductive layers. The dielectric coating is formed using a high dielectric constant material such as organic polymers and organic polymer mixtures. The present invention also includes forming a thin, dielectric coating between conductive layers on a substantially planar substrate material and an embedded capacitor to reduce loop inductance.