Molecular airborne contaminants (MACs) film removal and wafer surface sustaining system and method

A MACs mitigation system includes a MACs film removal sub-system ( 14 ) and a wafer surface sustaining sub-system ( 16 ) for sustaining or maintaining the cleaned surface ( 18 A) of a wafer ( 18 ) in a substantially MACs-free condition for some predetermined period of time, such as the typical amoun...

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Bibliographische Detailangaben
Hauptverfasser:	WOLF ROBERT G, DARWIN MICHAEL
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A MACs mitigation system includes a MACs film removal sub-system ( 14 ) and a wafer surface sustaining sub-system ( 16 ) for sustaining or maintaining the cleaned surface ( 18 A) of a wafer ( 18 ) in a substantially MACs-free condition for some predetermined period of time, such as the typical amount of time required after MACs film removal to perform a desired measurement on the wafer using a metrology tool ( 12 ). The MACs film removal sub-system can comprise a source ( 14 A) of microwave energy that beneficially both heats and dissociates the chemical constituents of the MACs film. The wafer surface sustaining sub-system can be co-located with a measurement stage portion of the metrology tool, and preferably includes an atmosphere provided by a source ( 20 ) of clean gas.