Atomic laminates for diffusion barrier applications

The present invention relates to a very thin multilayer diffusion barrier for a semiconductor device and fabrication method thereof. The multilayer diffusion barrier according to the present invention is fabricated by forming a very thin, multilayer diffusion barrier composed of even thinner sub-lay...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KIM HYUNGJUN, ROSSNAGEL STEPHEN M, BARMAK KATAYUN, NOYAN ISMAIL C
Format: Patent
Sprache:eng
Schlagworte:
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