INCLINED SOLDER WAVE METHODOLOGY FOR WAVE SOLDERING DOUBLE SIDED PIN-IN-HOLE ELECTRONIC COMPONENTS

An apparatus for applying solder to an electronic circuit board substrate includes a solder wave device for generating a molten wave of solder and, above that, a movable substrate holder. The substrate holder includes a support for an electronic circuit board substrate inclined at an angle with resp...

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Bibliographische Detailangaben
Hauptverfasser:	BULEY TODD H, MA WAI MON, WEIR JOHN P, CHAPMAN BRIAN, LAM ROGER
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	An apparatus for applying solder to an electronic circuit board substrate includes a solder wave device for generating a molten wave of solder and, above that, a movable substrate holder. The substrate holder includes a support for an electronic circuit board substrate inclined at an angle with respect to the direction and an opening on a bottom thereof for access of a protruding connector disposed near an end of the substrate to the molten solder wave. The angle of incline is sufficient to prevent a component disposed at a distance from the end of the substrate from contacting the molten solder wave when the substrate holder is moved over the solder wave device. A shield in the substrate holder prevents the component not to be soldered from contacting the molten solder wave.