Arrangement for improving module reliability

The invention relates to an arrangement for improving module reliability, in particular the reliability of soldered connections on semiconductor products with BGA or BGA-like components to a substrate on which chips are attached by a die attach material, in particular substrate-based IC packages, so...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	NOCKE KERSTIN, REISS MARTIN, BENDER CARSTEN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The invention relates to an arrangement for improving module reliability, in particular the reliability of soldered connections on semiconductor products with BGA or BGA-like components to a substrate on which chips are attached by a die attach material, in particular substrate-based IC packages, solder balls mounted on the side that is opposite from the chip, on contact pads of the substrate on a patterned copper foil, being provided for the electrical connection to printed circuit boards, and the chip and the substrate on the chip side being encapsulated with a mold cap. With the invention, it is intended to provide an arrangement for improving module reliability with which stress acting on the solder balls during alternating thermal loading is reduced. According to the invention, an intermediate layer (3) which consists of a compliant or flexible material is arranged at least between the contact pads (2) and the substrate (1) or the printed circuit board.