Method and apparatus for creating radial profiles on a substrate

The gradient deposition method and apparatus permits a radial thickness or composition gradient on a substrate to be formed. The system comprises one or more deposition sources that can be fired sequentially or simultaneously. The system also comprises one or more dynamic shutters (e.g., shutters th...

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Bibliographische Detailangaben
Hauptverfasser:	RAMBERG C. ERIC, WANG YOUQI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMBINATORIAL CHEMISTRY DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LIBRARIES, e.g. CHEMICAL LIBRARIES, IN SILICOLIBRARIES METALLURGY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION THEIR RELEVANT APPARATUS TRANSPORTING
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Beschreibung
Zusammenfassung:	The gradient deposition method and apparatus permits a radial thickness or composition gradient on a substrate to be formed. The system comprises one or more deposition sources that can be fired sequentially or simultaneously. The system also comprises one or more dynamic shutters (e.g., shutters that can be moved independently of each other and during the deposition of a material) in combination with equipment that permits the substrate to be rotated during the deposition of the material onto the substrate. The system may also include one or more contact masks that may be placed on the substrate during the deposition in order to mask off particular portions of the substrate during the deposition process.