Substrate treatment apparatus, substrate treatment method and substrate manufacturing method

Above a substrate mounted on rollers, an upper board is prepared a predetermined distance apart from the substrate. A pipe fills a space between the upper board and the substrate with washing water by supplying the washing water at a predetermined flow rate. A washing water layer is formed evenly on...

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Bibliographische Detailangaben
Hauptverfasser: IZAKI RYO, MORIGUCHI YOSHIHIRO, KAMAISHI TAKAO, YASUIKE YOSHITOMO, ISHIDA TAKAHISA
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Above a substrate mounted on rollers, an upper board is prepared a predetermined distance apart from the substrate. A pipe fills a space between the upper board and the substrate with washing water by supplying the washing water at a predetermined flow rate. A washing water layer is formed evenly on an upper surface of the substrate when the substrate passes below the upper board. Below the substrate, a lower board is prepared a predetermined distance apart from the substrate. A pipe fills a space between the lower board and the substrate with the washing water by supplying the washing water at a predetermined flow rate. A washing water layer is formed evenly on a lower surface of the substrate when the substrate passes above the lower board. The air emitted from an air knife is sprayed to the upper/lower surface of the substrate slantingly at a predetermined incident angle in an opposite direction of a substrate moving direction. The washing water is pushed away and removed from the upper/lower surface of the substrate.