Device for cutting or heating medical implants

The present invention relates to a hand-held device for cutting or heating medical implants, in particular for cutting and bending resorbable implants. The device comprises a heating element electrically connectable to a power source (e.g., a battery), a switch for selectively completing the circuit between the heating element and the power source, and a housing for enclosing the battery and associated electrical connections. The invention is directed to a kit comprising a handle assembly and multiple interchangeable cutting or heating tips for use therewith. One tip member is configured for heating an implant to a sufficient temperature to cut the implant while a second tip member is configured for heating the implant to a sufficient temperature to bend the implant. A tip member housing an additional power source may be provided to bend larger size implants.