Method and apparatus for preventing a furnace in a semiconductor process from temperature and gas excursion

To prevent a furnace in a semiconductor process from temperature and gas excursion, a paddle and spike thermal couples arranged on the sidewall of the tube and adjacent to the heater, respectively, are connected to a temperature controller to regulate the heater, and a mass controller adjusts the gas flow injected to the tube. In the method, the spike thermal couple, peddle thermal couple and zero point of the mass flow controller are checked to maintain within a first and second temperature ranges and a first gas flow speed range, respectively, and after wafers are loaded and temperature is ramped up, the peddle thermal couple and mass flow controller are checked again to maintain within a third temperature range and second gas flow speed range.