Methods for depositing a thickfilm dielectric on a substrate
Disclosed is a method for depositing a thickfilm dielectric on a substrate. The method commences with the deposition of a first layer of thickfilm dielectric on the substrate, followed by an air drying of the first layer to allow solvents to escape, thereby increasing the porosity of the first layer...
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| creator | CASEY JOHN F RAU R. FREDERICK DOVE LEWIS R DREHLE JAMES R JOHNSON ROSEMARY O LIU LING |
| description | Disclosed is a method for depositing a thickfilm dielectric on a substrate. The method commences with the deposition of a first layer of thickfilm dielectric on the substrate, followed by an air drying of the first layer to allow solvents to escape, thereby increasing the porosity of the first layer. The first layer is then oven dried. Thereafter, additional layers of thickfilm dielectric are deposited on top of the first layer, with each layer being oven dried after it is deposited. The deposited layers are then fired. |
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FREDERICK ; DOVE LEWIS R ; DREHLE JAMES R ; JOHNSON ROSEMARY O ; LIU LING</creatorcontrib><description>Disclosed is a method for depositing a thickfilm dielectric on a substrate. The method commences with the deposition of a first layer of thickfilm dielectric on the substrate, followed by an air drying of the first layer to allow solvents to escape, thereby increasing the porosity of the first layer. The first layer is then oven dried. Thereafter, additional layers of thickfilm dielectric are deposited on top of the first layer, with each layer being oven dried after it is deposited. The deposited layers are then fired.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CAPACITORS ; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; RESISTORS ; SEMICONDUCTOR DEVICES</subject><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20041223&DB=EPODOC&CC=US&NR=2004258841A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20041223&DB=EPODOC&CC=US&NR=2004258841A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CASEY JOHN F</creatorcontrib><creatorcontrib>RAU R. 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FREDERICK</creatorcontrib><creatorcontrib>DOVE LEWIS R</creatorcontrib><creatorcontrib>DREHLE JAMES R</creatorcontrib><creatorcontrib>JOHNSON ROSEMARY O</creatorcontrib><creatorcontrib>LIU LING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CASEY JOHN F</au><au>RAU R. FREDERICK</au><au>DOVE LEWIS R</au><au>DREHLE JAMES R</au><au>JOHNSON ROSEMARY O</au><au>LIU LING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Methods for depositing a thickfilm dielectric on a substrate</title><date>2004-12-23</date><risdate>2004</risdate><abstract>Disclosed is a method for depositing a thickfilm dielectric on a substrate. 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| subjects | BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESISTORS SEMICONDUCTOR DEVICES |
| title | Methods for depositing a thickfilm dielectric on a substrate |
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