Methods for depositing a thickfilm dielectric on a substrate

Disclosed is a method for depositing a thickfilm dielectric on a substrate. The method commences with the deposition of a first layer of thickfilm dielectric on the substrate, followed by an air drying of the first layer to allow solvents to escape, thereby increasing the porosity of the first layer...

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Bibliographische Detailangaben
Hauptverfasser:	CASEY JOHN F, RAU R. FREDERICK, DOVE LEWIS R, DREHLE JAMES R, JOHNSON ROSEMARY O, LIU LING
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESISTORS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Disclosed is a method for depositing a thickfilm dielectric on a substrate. The method commences with the deposition of a first layer of thickfilm dielectric on the substrate, followed by an air drying of the first layer to allow solvents to escape, thereby increasing the porosity of the first layer. The first layer is then oven dried. Thereafter, additional layers of thickfilm dielectric are deposited on top of the first layer, with each layer being oven dried after it is deposited. The deposited layers are then fired.