Method and apparatus for high-resolution defect location and classification

Method and apparatus for high-resolution defect location and classification

In the manufacture of integrated circuits on a wafer, it is necessary to monitor the manufacturing process by inspecting the ICs as to whether errors or defects have occurred during production. It is already known to use a scattered-light device (32) to determine whether a defect is present on the w...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: WIENECKE JOACHIM
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING RECORD CARRIERS
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
SEMICONDUCTOR DEVICES
TESTING
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Beschreibung
Zusammenfassung:In the manufacture of integrated circuits on a wafer, it is necessary to monitor the manufacturing process by inspecting the ICs as to whether errors or defects have occurred during production. It is already known to use a scattered-light device (32) to determine whether a defect is present on the wafer. According to the present invention, defect examination is now improved in that defect-suspected regions (33) are identified using the scattered-light device (32). With a further examination system (30, 28) different from the scattered-light device (32), a determination is then made as to whether the defect-suspected regions (33) are defects. The latter can then also be classified.