Method of processing a workpiece, and a work carrier, in particular of porous ceramic

Explained, inter alia, is a method in which a workpiece (52) to be processed is fastened to a work carrier (10) by means of a solid (62). The work carrier (10) is made of a porous material, e.g. of porous ceramic. This processing method permits simple manipulation of the wafer during the processing....

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Bibliographische Detailangaben
Hauptverfasser:	KRONINGER WERNER, LANG GUNTER
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GRINDING MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS TRANSPORTING
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Beschreibung
Zusammenfassung:	Explained, inter alia, is a method in which a workpiece (52) to be processed is fastened to a work carrier (10) by means of a solid (62). The work carrier (10) is made of a porous material, e.g. of porous ceramic. This processing method permits simple manipulation of the wafer during the processing. In addition, the workpiece (52) can be easily separated from the work carrier (10) using a solvent.