Fabrication process for a magnetic tunnel junction device
A magnetic random access memory device having a magnetic tunnel junction is provided, as well as methods of fabricating the same. The magnetic tunnel junction includes a first magnetic layer, a second magnetic layer, a tunnel barrier layer, and dielectric material portions. The first magnetic layer...
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creator | FINDEIS FRANK RABERG WOLFGANG KASKO IHAR |
description | A magnetic random access memory device having a magnetic tunnel junction is provided, as well as methods of fabricating the same. The magnetic tunnel junction includes a first magnetic layer, a second magnetic layer, a tunnel barrier layer, and dielectric material portions. The first magnetic layer is formed over the second magnetic layer. The tunnel barrier layer is located between the first and second magnetic layers. The dielectric material portions are formed on sidewalls of the first magnetic layer and over the second magnetic layer. The dielectric material portions may be formed directly atop the second magnetic layer. In another embodiment, the dielectric material portion may be formed directly atop the tunnel barrier layer. Preferably, the dielectric material portions prevent shorts from developing across the tunnel barrier layer during the etching of the second magnetic layer. |
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The magnetic tunnel junction includes a first magnetic layer, a second magnetic layer, a tunnel barrier layer, and dielectric material portions. The first magnetic layer is formed over the second magnetic layer. The tunnel barrier layer is located between the first and second magnetic layers. The dielectric material portions are formed on sidewalls of the first magnetic layer and over the second magnetic layer. The dielectric material portions may be formed directly atop the second magnetic layer. In another embodiment, the dielectric material portion may be formed directly atop the tunnel barrier layer. Preferably, the dielectric material portions prevent shorts from developing across the tunnel barrier layer during the etching of the second magnetic layer.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20041118&DB=EPODOC&CC=US&NR=2004229430A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20041118&DB=EPODOC&CC=US&NR=2004229430A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FINDEIS FRANK</creatorcontrib><creatorcontrib>RABERG WOLFGANG</creatorcontrib><creatorcontrib>KASKO IHAR</creatorcontrib><title>Fabrication process for a magnetic tunnel junction device</title><description>A magnetic random access memory device having a magnetic tunnel junction is provided, as well as methods of fabricating the same. The magnetic tunnel junction includes a first magnetic layer, a second magnetic layer, a tunnel barrier layer, and dielectric material portions. The first magnetic layer is formed over the second magnetic layer. The tunnel barrier layer is located between the first and second magnetic layers. The dielectric material portions are formed on sidewalls of the first magnetic layer and over the second magnetic layer. The dielectric material portions may be formed directly atop the second magnetic layer. In another embodiment, the dielectric material portion may be formed directly atop the tunnel barrier layer. Preferably, the dielectric material portions prevent shorts from developing across the tunnel barrier layer during the etching of the second magnetic layer.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB0S0wqykxOLMnMz1MoKMpPTi0uVkjLL1JIVMhNTM9LLclMVigpzctLzVHIKs1LBitLSS3LTE7lYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyalA7fGhwUYGBiZGRpYmxgaOhsbEqQIABNcvqQ</recordid><startdate>20041118</startdate><enddate>20041118</enddate><creator>FINDEIS FRANK</creator><creator>RABERG WOLFGANG</creator><creator>KASKO IHAR</creator><scope>EVB</scope></search><sort><creationdate>20041118</creationdate><title>Fabrication process for a magnetic tunnel junction device</title><author>FINDEIS FRANK ; RABERG WOLFGANG ; KASKO IHAR</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2004229430A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2004</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>FINDEIS FRANK</creatorcontrib><creatorcontrib>RABERG WOLFGANG</creatorcontrib><creatorcontrib>KASKO IHAR</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FINDEIS FRANK</au><au>RABERG WOLFGANG</au><au>KASKO IHAR</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Fabrication process for a magnetic tunnel junction device</title><date>2004-11-18</date><risdate>2004</risdate><abstract>A magnetic random access memory device having a magnetic tunnel junction is provided, as well as methods of fabricating the same. The magnetic tunnel junction includes a first magnetic layer, a second magnetic layer, a tunnel barrier layer, and dielectric material portions. The first magnetic layer is formed over the second magnetic layer. The tunnel barrier layer is located between the first and second magnetic layers. The dielectric material portions are formed on sidewalls of the first magnetic layer and over the second magnetic layer. The dielectric material portions may be formed directly atop the second magnetic layer. In another embodiment, the dielectric material portion may be formed directly atop the tunnel barrier layer. Preferably, the dielectric material portions prevent shorts from developing across the tunnel barrier layer during the etching of the second magnetic layer.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Fabrication process for a magnetic tunnel junction device |
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