Stencil and method for depositing material onto a substrate

A stencil and method for depositing a coupon of underfill material onto a substrate that is to receive an integrated circuit die.

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Bibliographische Detailangaben
1. Verfasser:	WATSON JEFFREY R
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A stencil and method for depositing a coupon of underfill material onto a substrate that is to receive an integrated circuit die.