STACK-TYPE MULTI-CHIP PACKAGE AND METHOD OF FABRICATING BUMPS ON THE BACKSIDE OF A CHIP

A stack-type multi-chip package at least comprising a substrate, a first chip, a second chip, a plurality of bump pads, a plurality of bumps, a plurality of first conductive wires, a plurality of second conductive wires and some packaging material. The backside of the first chip is attached to the s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHANG CHIH-HUANG, WEN SHAUUO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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