Valve assembly for microfluidic devices, and method for opening and closing same

A normally open fluid manipulation valve assembly and system and a method for closing, re-opening and re-closing same. The normally open valve assembly can include a substrate including a first surface, with first and second recesses formed in the first surface. A recessed channel can be formed in t...

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Bibliographische Detailangaben
Hauptverfasser:	MEAD DENNIS E, BRYNING ZBIGNIEW T
Format:	Patent
Sprache:	eng
Schlagworte:	ACTUATING-FLOATS BLASTING CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY COCKS DEVICES FOR VENTING OR AERATING ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES LIGHTING MEASURING MECHANICAL ENGINEERING MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PHYSICS TAPS TESTING THEIR RELEVANT APPARATUS THERMAL INSULATION IN GENERAL TRANSPORTING VALVES WEAPONS
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Beschreibung
Zusammenfassung:	A normally open fluid manipulation valve assembly and system and a method for closing, re-opening and re-closing same. The normally open valve assembly can include a substrate including a first surface, with first and second recesses formed in the first surface. A recessed channel can be formed in the first surface. The recessed channel can extend from the first recess to the second recess and can be at least partially defined by a first deformable material having a first modulus of elasticity. The valve assembly can also include an elastically deformable cover. The elastically deformable cover can include a layer of an elastically deformable material having a modulus of elasticity that is greater than the modulus of elasticity of the first deformable material, and an adhesive layer that contacts the first surface of the substrate.