Impact-strength-modified polymer compositions

A conductive, impact-strength-modified polyamide molding composition is disclosed. The composition contains A) 40 to 99 parts by weight polyamide, B) 0.5 to 50 parts by weight graft polymer, C) 0.1 to 30 parts by weight mineral in particulate form, D) 0 to 1.5 parts by weight electrically conductive...

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Bibliographische Detailangaben
Hauptverfasser:	QUAAS GERWOLF, SEIDEL ANDREAS, VATHAUER MARC
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A conductive, impact-strength-modified polyamide molding composition is disclosed. The composition contains A) 40 to 99 parts by weight polyamide, B) 0.5 to 50 parts by weight graft polymer, C) 0.1 to 30 parts by weight mineral in particulate form, D) 0 to 1.5 parts by weight electrically conductive carbon particles, E) 0.1 to 15 parts by weight of at least one member selected from the group consisting of polyester ether amide, polyester/ether block copolymer and polyamide/polyester block copolymer. Embodiments that further contain any of compatibility promoter, vinyl (co)polymer, phenolformaldehyde resin and polymer additive are also disclosed. The composition is particularly suitable for online lacquering.