Semiconductor device, method of manufacturing the same, and electronic device using the semiconductor device

To provide a low-cost semiconductor device that obtains a reduction in pitch and an increase in the number of pins using conventional equipment and to provide a method of manufacturing the semiconductor device. The semiconductor device according to the present invention includes: a flexible printed...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MAKITA YOSHIHIRO, ENDOU KIYOHITO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS PICTORIAL COMMUNICATION, e.g. TELEVISION PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	To provide a low-cost semiconductor device that obtains a reduction in pitch and an increase in the number of pins using conventional equipment and to provide a method of manufacturing the semiconductor device. The semiconductor device according to the present invention includes: a flexible printed circuit, on which a semiconductor chip is mounted, having a connection terminal portion that includes a plurality of land-shaped connection terminals arranged in a step form or a grid form and an insulating film provided to a conductor connected with the respective land-shaped connection terminals. Further, a method of manufacturing a semiconductor device according to the present invention includes: forming a flexible printed circuit including a connection terminal portion in which a plurality of land-shaped connection terminals are arranged in a step form or a grid form and an insulating film is provided to a conductor connected with the respective land-shaped connection terminals; mounting a semiconductor chip on the flexible printed circuit; and separating a semiconductor device from the flexible printed circuit by cutting a portion of each of outermost land-shaped connection terminals.