Method of and apparatus for plastic optical-chip encapsulation

Method of and apparatus for plastic optical-chip encapsulation

An opto-mechanical interface apparatus includes an optical hybrid, an electronic hybrid adapted to receive electronic components, an adapter fixture for fixing the electronic hybrid and the optical hybrid to one another to form a combined hybrid, a lower-capsule part, and an upper-capsule part adapt...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MOLL HANSRISTER, SOLEHAV ANNIKA, ENGSTRAND JAN-AKE, ERIKSEN PAUL, FALK JAN-ERIK, STEIJER ODD, HAMBERG IVAR, HOLM ULF, PALM TORBJORN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An opto-mechanical interface apparatus includes an optical hybrid, an electronic hybrid adapted to receive electronic components, an adapter fixture for fixing the electronic hybrid and the optical hybrid to one another to form a combined hybrid, a lower-capsule part, and an upper-capsule part adapted to mate with the lower-capsule part. Mating of the upper-capsule part and the lower-capsule part encloses at least part of the combined hybrid. The apparatus forms an opto-mechanical interface for making external optical connection(s).