3D MEMS/MOEMS package

Two substrates each carrying MEMS or MOEMS structures are bonded face to face and interconnected to form a compact surface-mountable package.

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Bibliographische Detailangaben
Hauptverfasser:	CHONG YOK RUE DESMOND, SUN YI-SHENG, KAPOOR RAHUL
Format:	Patent
Sprache:	eng
Schlagworte:	MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING
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Beschreibung
Zusammenfassung:	Two substrates each carrying MEMS or MOEMS structures are bonded face to face and interconnected to form a compact surface-mountable package.