Sole structure for electrostatic dissipative footwear and method of making same

An electrostatic circuit for a sole having an outsole, an insole and a midsole positioned between the insole and outsole. In one embodiment, the electrostatic circuit includes at least one conductor path that is printed on a first side of a first substrate. The conductor path may have a first exposed end attachable to the outsole and a second exposed end attachable to the insole. The electrostatic circuit may also include at least one resistor electrically that is coupled to each conductor path and mounted to the first substrate. In another embodiment, the electrostatic circuit may include first and second conductive pads attached to the first and second ends of each conductor path.