Method of forming a planarized bond pad structure

A method of forming a planarized bond pad structure in a bond pad opening, while removing bond pad material from an opening in a non-device region used for scribe line formation, has been developed. A first iteration of this invention features the formation of the planarized bond bad structure in a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HUANG CHENGUNG, WU TIENI, CHEN KUOOU, SU YEA-ZAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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