Brittle material rotating and aligning mechanism for use in a brittle material scribing and/or breaking apparatus

A brittle material rotating and aligning mechanism comprising a bearing, a rotary table and a driving mechanism and installed in the worktable of a brittle material scribing and breaking apparatus is disclosed to carry a brittle material, for example, a semiconductor wafer for scribing and breaking into individual dies. The driving mechanism uses a flexible transmission member to rotate the rotary table for the advantages of low installation cost and no requirement for a precision adjustment during installation and, preventing the occurrence of back lash or the production of particles due to friction between the transmission member and the driving wheel of the driving mechanism, or between the transmission member and the rotary table.