Method of connecting module layers suitable for the production of microstructure modules and a microstructure module

Known manufacturing methods for microstructure components, in particular for microreactors, micro-heat exchangers, and micromixers, are not reliable enough to ensure that the component's pressure and corrosion resistance is high enough, that the component's tightness against fluid exiting...

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Hauptverfasser: MEYER HEINRICH, FRIZ WOLFGANG, HERBER RALPH, RINGTUNATUS OLIVER, CRAMER KONRAD, KURTZ OLAF, SCHWIEKENDICK CARSTEN, MADRY CHRISTIAN
Format: Patent
Sprache:eng
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Zusammenfassung:Known manufacturing methods for microstructure components, in particular for microreactors, micro-heat exchangers, and micromixers, are not reliable enough to ensure that the component's pressure and corrosion resistance is high enough, that the component's tightness against fluid exiting from the component or fluid spilling over into adjacent microchannels is high enough, and that the microchannels have a sufficiently low flow resistance. In addition, known manufacturing methods are not cost-effective enough that the microstructured components can be employed in a wide variety of applications. In order to solve these problems, for manufacturing microstructure components at least one multifunctional barrier coating is applied to the joining surfaces of microstructured component layers made of aluminum and/or aluminum alloys, copper/copper alloys, and/or noble steels, and at least one solder/brazing coating is applied to the at least one barrier coating, the component layers are stacked, and the component layers are then soldered/brazed using heat.