Multi-layer film for hot melt packaging

Multi-layer films are used to package hot melt adhesives. The packaging film does not require removal prior to use of the adhesive. Multi-layer films wherein at least one layer has a melting point below about 100° C. is used to package low application temperature hot melt adhesives.

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Bibliographische Detailangaben
Hauptverfasser: HANER DALE L, HARWELL MICHAEL G, RYAN LEISA A
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Multi-layer films are used to package hot melt adhesives. The packaging film does not require removal prior to use of the adhesive. Multi-layer films wherein at least one layer has a melting point below about 100° C. is used to package low application temperature hot melt adhesives.