Electrical connector having improved elastomeric contact pressure pad

A high-density electrical connector includes a rigid member having an array of electrical contact pads, a clamp housing attached to the rigid member, and a flexible printed circuit. The flexible printed circuit has a back surface, a front surface and a contact portion having a matching array of electrical contacts protruding outwardly of the front surface of the flexible printed circuit. The contact portion is disposed between the clamp housing and the rigid member and an elastomeric contact pressure pad is disposed between the clamp housing and the flexible printed circuit pressing each of the protruding electrical contacts into one of the electrical contact pads. The elastomeric pad is shaped and resiliently deformed by the clamp housing to provide a substantially uniform contact pressure to the array of electrical contacts.