Patterned deposition using compressed carbon dioxide

A method for the patterned deposition of a material comprises the steps of dissolving or suspending said material in a solvent phase comprising compressed carbon dioxide, and depositing the solution or suspension onto a surface, evaporation of the solvent phase leaving a patterned deposit of said ma...

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Bibliographische Detailangaben
Hauptverfasser:	GASPAR FILIPE, SANTOS REGINA, AL-DURI BUSHRA, HUCK WILHELM THEODORUS STEFANUS, SEVILLE JONATHAN, LEEKE GARY, LUSCOMBE CHRISTINE KEIKO, LU TIEJUN, HOLMES ANDREW BRUCE
Format:	Patent
Sprache:	eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	A method for the patterned deposition of a material comprises the steps of dissolving or suspending said material in a solvent phase comprising compressed carbon dioxide, and depositing the solution or suspension onto a surface, evaporation of the solvent phase leaving a patterned deposit of said material. This method is particularly suitable for the patterned deposition of polymers and small organic molecules in organic light emitting diodes and organic transistors.