Device for assembling components on a substrate

A device for assembly of components, in particular semiconductor chips, on a substrate having a first traversing unit for picking up the component together with a component holder at a first location and setting down the component at a second location on the substrate is described, a position measuring unit for optically determining an actual position of the component as a function of an actual position of the substrate being situated on an optical traversing unit for traversing the position measuring unit from a working position in the area of the substrate to a resting position; this permits fully automatic assembly of a wide variety of components on substrates and at the same time has a high throughput in interlinked production and a very high positioning precision. This is achieved by the fact that the substrate is situated on a conveyance device for largely continuous supply and removal of numerous substrates to and from the device.