Via connector and method of making same

Via connector and method of making same

An insulator substrate or printed circuit board (PCB) having a filled and plated via. A sidewall of the via and preferably opposite sides of the insulator substrate are first plated with a conductive material. The plated via is then filled with an electrically conductive fill composition. A conducti...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: PARKER JOHN LEROY, MISCIKOWSKI PAMELA L
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:An insulator substrate or printed circuit board (PCB) having a filled and plated via. A sidewall of the via and preferably opposite sides of the insulator substrate are first plated with a conductive material. The plated via is then filled with an electrically conductive fill composition. A conductive cap layer is preferably formed over both ends of the conductive fill composition and the opposite surfaces of the insulator substrate, and can be bonded to a surface mount contact as a land or a pad.