Dispensation of controlled quantities of material onto a substrate

The invention provides an apparatus and method for dispensing material onto a substrate. The apparatus comprises a dispensing system having a dipenser and a control system adapted to adjust a quantity of material to be dispensed onto the substrate. It also includes an image capturing system adapted...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	LAM WING FAI, CHAU MAN LAI MANLY, MAK KA YEE, HUI HON CHIU
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention provides an apparatus and method for dispensing material onto a substrate. The apparatus comprises a dispensing system having a dipenser and a control system adapted to adjust a quantity of material to be dispensed onto the substrate. It also includes an image capturing system adapted to acquire an image of the material that is dispensed onto the substrate, a measuring system to analyze the image and measure the quantity of material dispensed, and a compensation system adapted to provide a correction signal to the control system to vary the quantity of material dispensed.