Orthogonal interface for connecting circuit boards carrying differential pairs

An electrical connector assembly is provided including a plurality of wafers having ground and signal traces with the signal traces being arranged in differential pairs, a first connector housing including channels adapted to retain a first group of wafers, and a second connector housing including channels adapted to retain a second group of wafers. The electrical connector assembly also includes signal contacts joining the differential pairs of the signal traces on the first group of wafers with corresponding differential pairs of the signal traces on the second group of wafers. The first and second connector housings join the first group of wafers in a non-parallel relationship to the second group of wafers.