Flexible circuit substrate

A flexible circuit substrate includes a laminate which contains a polymer film, a VIB group metal layer sputtered on the polymer film, a nickel-chromium alloy layer sputtered on the VIB group metal layer, and a copper layer formed on the nickel-chromium alloy layer. The VIB group metal layer is sele...

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Bibliographische Detailangaben
Hauptverfasser:	HUANG TANGIEH, CHUANG CHAUIN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A flexible circuit substrate includes a laminate which contains a polymer film, a VIB group metal layer sputtered on the polymer film, a nickel-chromium alloy layer sputtered on the VIB group metal layer, and a copper layer formed on the nickel-chromium alloy layer. The VIB group metal layer is selected from the group consisting of chromium, molybdenum, and tungsten. The VIB group metal layer is free of metal oxide. The VIB group metal layer and the nickel-chromium alloy layer are formed by a sputtering process using an oxygen-free inert atmosphere containing argon.