Method for plating metal onto wafers

A method for chemical plating a substrate is provided. Embodiments of the method include evacuating an enclosure having a substrate disposed therein under vacuum, filling the enclosure with an electrolyte solution having a pressure between about 0.5 atm and about 200 atm, chemical plating a metal layer on a surface of the substrate, and draining the electrolyte solution from the enclosure. In another aspect, the method includes energizing an ultrasonic source to agitate the electrolyte solution substantially simultaneous with the step of chemical plating a metal layer on a surface of the substrate. In still another aspect, the method includes varying the pressure of the plating cell to agitate the electrolyte solution. In yet another aspect, the method includes increasing a pressure of the electrolyte solution by heating the electrolyte solution.