Optical coupler hub for chemical-mechanical-planarization polishing pads with an integrated optical waveguide

An apparatus is disclosed which improves the optical monitoring of semi-conductor wafers undergoing chemical mechanical planarization (CMP). The apparatus consists of a hub containing printed circuit board mounted optical and electronic devices, which couple light into a waveguide integrated into a...

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Bibliographische Detailangaben
1. Verfasser:	WOLF STEPHAN H
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	An apparatus is disclosed which improves the optical monitoring of semi-conductor wafers undergoing chemical mechanical planarization (CMP). The apparatus consists of a hub containing printed circuit board mounted optical and electronic devices, which couple light into a waveguide integrated into a CMP polishing pad. The hub is attached to the CMP polishing pad and rotates with the pad during the CMP operation. The electronics sense light emitting from the waveguide, convert the light into an electrical signal, amplify and analyze the electrical signal, and communicate the result of the analysis to remote CMP tool control systems.