Extruded heatsink and EMC enclosure

Extruded heatsink and EMC enclosure

An enclosed electronic component is provided by extruding first and second heatsink members having a plurality of cooling structures disposed on first surfaces thereof and an electronic component board between the first and second heatsinks, with a pair of joining members and conductive gaskets to f...

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Hauptverfasser: ATKINSON JOHN C, SHEARMAN SIMON E
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator ATKINSON JOHN C
SHEARMAN SIMON E
description An enclosed electronic component is provided by extruding first and second heatsink members having a plurality of cooling structures disposed on first surfaces thereof and an electronic component board between the first and second heatsinks, with a pair of joining members and conductive gaskets to form an electromagnetically sealed enclosure and a thermal pathway to remove heat from the electronic component.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Extruded heatsink and EMC enclosure
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