Extruded heatsink and EMC enclosure
An enclosed electronic component is provided by extruding first and second heatsink members having a plurality of cooling structures disposed on first surfaces thereof and an electronic component board between the first and second heatsinks, with a pair of joining members and conductive gaskets to f...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | An enclosed electronic component is provided by extruding first and second heatsink members having a plurality of cooling structures disposed on first surfaces thereof and an electronic component board between the first and second heatsinks, with a pair of joining members and conductive gaskets to form an electromagnetically sealed enclosure and a thermal pathway to remove heat from the electronic component. |
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