Electronic package and method
An electronic package and method furnish shorter wire bonds for smaller chips by increasing the length of the leads and decreasing the size of the paddle. A portion of each lead is reduced in thickness such that the polymeric material exposes only a portion of the lead, e.g., that portion that meets...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | An electronic package and method furnish shorter wire bonds for smaller chips by increasing the length of the leads and decreasing the size of the paddle. A portion of each lead is reduced in thickness such that the polymeric material exposes only a portion of the lead, e.g., that portion that meets industry standards. Since the wire bonds are shorter, the electronic package exhibits less inductance and, hence, increased performance. |
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