Encapsulation by coating with a mixture of lipids and hydrophobic, high melting point compounds
An encapsulated ingredient is disclosed comprising an ingredient component and a coating component. The coating component includes a lipid and one or more hydrophobic, high melting point compounds. The coating component typically has a melting point of at least about 70° C.
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | An encapsulated ingredient is disclosed comprising an ingredient component and a coating component. The coating component includes a lipid and one or more hydrophobic, high melting point compounds. The coating component typically has a melting point of at least about 70° C. |
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