Encapsulation by coating with a mixture of lipids and hydrophobic, high melting point compounds

An encapsulated ingredient is disclosed comprising an ingredient component and a coating component. The coating component includes a lipid and one or more hydrophobic, high melting point compounds. The coating component typically has a melting point of at least about 70° C.

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: FRUMHOLTZ PIERRE P, JOBE PATRICK ANDREW, MCGOOGAN BRUCE BRIM
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:An encapsulated ingredient is disclosed comprising an ingredient component and a coating component. The coating component includes a lipid and one or more hydrophobic, high melting point compounds. The coating component typically has a melting point of at least about 70° C.