Wafer fabrication having improved laserwise alignment recovery

Wafer fabrication having improved laserwise alignment recovery

A recovery system for recovering alignment marks obscured by a deposited obscuring layer. The system includes an imaging system to locate the obscured alignment marks. The located alignment marks are recovered through the obscuring layer to use the alignment marks to align patterned layers of a fabr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BURBANK DANIEL P, NAUGHTON KENNETH P
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Beschreibung
Zusammenfassung:A recovery system for recovering alignment marks obscured by a deposited obscuring layer. The system includes an imaging system to locate the obscured alignment marks. The located alignment marks are recovered through the obscuring layer to use the alignment marks to align patterned layers of a fabricated structure.