Moisture curing hot-melt adhesives

The present invention is directed to a moisture curable, hot melt adhesive coating and/or sealant composition. The composition comprises (a) a first isocyanate-terminated prepolymer comprising the reaction product of an at least essentially semicrystalline hydroxy-functional material (Component A) a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	TANGEN JOHN C
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention is directed to a moisture curable, hot melt adhesive coating and/or sealant composition. The composition comprises (a) a first isocyanate-terminated prepolymer comprising the reaction product of an at least essentially semicrystalline hydroxy-functional material (Component A) and a polyisocyanate; (b) a second isocyanate-terminated prepolymer comprising the reaction product of an essentially semicrystalline poly(tetramethylene ether) glycol that has a molecular weight of at least about 1000 (Component B) and a polyisocyanate; and (c) a third isocyanate-terminated prepolymer comprising the reaction product of an essentially amorphous hydroxy-functional material (Component C) and a polyisocyanate, the essentially amorphous hydroxy-functional material having an average functionality less than 2.5 and a Tg